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[Data] Shirutoku Report No. 4 #Interface Circuit

[Data] Shirutoku Report No. 4 #Interface Circuit

Promote development design! Custom measurement and interface circuits.

★★Shirutoku Report: Useful Information You Can Benefit From★★ This report introduces the use of "interface circuits" that make measurement convenient, which is being developed by the Custom Technology Division. Our company occasionally prepares highly versatile "interface circuits" as originals, and this time we are featuring one of those examples. Proposing solutions to our customers' challenges is a hallmark of our services. If you are interested, we look forward to hearing from you. 【Contents (Excerpt)】 ■ Providing services centered around custom measurement ■ What is an interface circuit? ■ Image of the configuration of an interface circuit (analog isolation circuit board) ■ Production board for the interface circuit (analog isolation circuit board) *For more details, please refer to the PDF document or feel free to contact us.

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Aluminum foil etched circuit board

Aluminum foil etched circuit board

Low-cost large-area flexible printed circuit boards! Lightweight and long, they can also be supplied in roll form.

We are etching laminated materials of aluminum foil and film to form circuits. The thickness of the aluminum foil and the type and thickness of the film can be adjusted according to your requirements.

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Thin film circuit board thin film metallization

Thin film circuit board thin film metallization

MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.

Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. By combining the thin film metallization technology that MARUWA has cultivated over many years with the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. Using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.

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Dynamic Map "Millimeter Wave Wiring Circuit Board"

Dynamic Map "Millimeter Wave Wiring Circuit Board"

Patent research materials related to millimeter wave wiring circuit boards.

We provide a dynamic map titled "Millimeter Wave Wiring Circuit Board," which focuses on wiring board technology that supports millimeter wave and terahertz wave transmission, as well as related materials and electronic component technologies. This dynamic map utilizes recent domestic public patent information, where technical experts conduct patent research and classification to track the activities of companies and research institutions working on 6G. It visualizes the movements of technology through patent information, offering an overview of the advanced patent environment. 【Related Materials】 ■ Dynamic Map "Post 5G - 6G Low Dielectric and Low Loss Materials" ■ Dynamic Map "6G and Transmission Lines" ■ Dynamic Map "Metamaterial Application Development" ■ Patent Guidebook "Information and Communication Series" ■ Invention Derivation Guidebook "Information and Communication Series" *For more details, please download the PDF or feel free to contact us.

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Fine flexible circuit board

Fine flexible circuit board

Achieving fine pattern processing using methods such as etching and additive techniques!

FPC (Flexible Printed Circuit) boards are circuit boards with copper electrodes patterned on a polyimide film as the base material. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction processing on both sides is possible. For more details, please contact us or refer to the catalog.

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